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| Thermal-mechanical coupling damage behavior of material based on peridynamics |
| Received:December 04, 2022 Revised:February 10, 2023 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7511/jslx20221204002 |
| KeyWord:bond-based peridynamics thermal-mechanical coupling Poisson’s ratio ceramic crack |
| Author | Institution |
| 邵滨 |
武汉科技大学 理学院, 武汉 |
| 姜翠香 |
武汉科技大学 理学院, 武汉 |
| 曾金宝 |
武汉科技大学 理学院, 武汉 |
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| Abstract: |
| In order to study the damage behavior of materials under thermal loading,a two-parameter bond-based peridynamics thermal-mechanical coupling model is proposed and the fracture criterion of the bond is given in this paper.This model includes the relationship of the bond’s tangential deformation with the temperature.Compared with the bond-based peridynamics thermal-mechanical coupling model,the materials without a fixed Poisson’s ratio are considered in this model,so that this model can be applied to study the effects of Poisson’s ratio on damage behavior of materials under thermal loading.The damage behavior simulation of a ceramic plate under thermal shock loading is carried out,which shows that the crack initiation and propagation patterns obtained by this model are in agreement with the experimental results.Further researches on the influence of Poisson’s ratio on material damage behavior show that,increasing Poisson’s ratio results in earlier initiation of cracks,growth of the crack spacing and increase of the leading crack length,which indicates that the Poisson’s ratio significantly influences the material damage behavior under thermal loading. |
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