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| An envelope-criterion method for thin plate optimization under a transient heat transfer process |
| Received:March 01, 2018 Revised:April 19, 2018 |
| View Full Text View/Add Comment Download reader |
| DOI：10.7511/jslx20180301001 |
| KeyWord:optimization thin plate transient heat transfer thermo-mechanical coupling envelope-criterion method |
| Author | Institution |
| 孙国 |
大连理工大学 工业装备结构分析国家重点实验室 工程力学系, 大连 |
| 阎琨 |
大连理工大学 工业装备结构分析国家重点实验室 工程力学系, 大连 |
| 蔡贤辉 |
大连理工大学 工业装备结构分析国家重点实验室 工程力学系, 大连 |
| 程耿东 |
大连理工大学 工业装备结构分析国家重点实验室 工程力学系, 大连 |
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| Abstract: |
| Stiffness and strength are main performance indicators of thin plate structures.In a transient heat transfer process,considering thermo-mechanical coupling,the temperature distribution is nonuniform and time variant,resulting in thermal deformations and thermal stresses in a structure.The variation of a temperature field depends on the thickness of the plate,and affects the stiffness and strength of a plate. Hence,the complex influence of the temperature field makes the optimization problem more nonlinear and more difficult to solve.In this paper,an envelope-criterion method is presented to deal with the structural optimization with such a complex temperature field.First,a structural compliance optimization design is carried out for external loads. Based on this design,by calculating multiple time index functions and taking the envelope,the above optimization results are modified iteratively to eliminate the higher local stress under transient temperature field.Some numerical examples are given and the results show that the method is effective for thin plate optimization in a transient heat transfer process. |
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