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| Molecular dynamic simulation for uniaxial tension properties of bicrystal Cu with spherical void |
| Received:August 23, 2008 |
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| DOI：10.7511/jslx20102026 |
| KeyWord:molecular dynamic bicrystal copper void interface |
| Author | Institution |
| 张宁 |
华中科技大学 力学系,武汉 |
| 杨新华 |
华中科技大学 力学系,武汉 |
| 陈传尧 |
华中科技大学 力学系,武汉 |
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| Abstract: |
| Molecular dynamic method is utilized for simulating bicrystal copper samples with spherical voids under uniaxial tension, and effects of two kinds of voids, inside the grains and on the boundary, on mechanical behaviors of bicrystals are investigated. It is shown from the results that the elastic modulus and yield stress of crystals decrease obviously due to voids. For the case that voids are inside the grains and symmetric with regard to the boundary, the elastic modulus and yield stress both increase with the increase of the distance between voids, and decrease with the increase of the void radius on the condition that the distance between voids is assumed to be constant. For the case that a void lies in the grain boundary, the void shape has great influence on tensile properties, and the elastic modulus and the yield stress both decrease gradually with the increase of the void radius. If the total volume of voids is fixed, the elastic modulus and the yield stress drop down when the void amount increases. |
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