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Study on multiple objective topology optimization of thermal conductive structure |
Revised:June 03, 2005 |
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DOI:10.7511/jslx20075121 |
KeyWord:optimal structural design,multi-objective optimization,topology optimization,optimization criteria algorithm,thermal conductive structure |
ZUO Kong-tian ZHAO Yu-dong CHEN Li-ping |
1.State Key Laboratory for Automobile Safety and Energy,Tsinghua University,Beijing 100084,China;2.National Engineering Research Center for CAD,Huazhong University of Science and Technology,Wuhan 430074,China |
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Abstract: |
A new idea to design the optimal heat conductive body with topology optimization method is proposed in this paper.Some important subjects,such as,material interpolation schemes,optimal mathematical model,sensitivity analysis method and optimizer fit for multi-objective topology design of heat conductive structure are deeply discussed.A multiple objective topology optimization method based on minimizing structure's compliance and optimal thermal conduction efficiency is proposed and the corresponding topology optimization model is established.An optimization criteria algorithm on the basis of SIMP(solid isotropic material with penalization model) material interpolation scheme,which is used for updating the design variable,is deduced from the Lagrange function in this paper.The corresponding sensitivity analysis equations for single objective and multi-objective are also deduced.Two numerical examples verified the effectiveness of methods and algorithms proposed in this paper. |
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