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| Using the semi-anal ytical Hamil ton method to study the thermal interl aminate stress of composites during cooling down process |
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| DOI：10.7511/jslx19983052 |
| KeyWord:laminates,thermal stress,semi-analytical Hamilton method,transient |
| Yang Zhenglin |
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| Abstract: |
| In this paper the incremental equations of semi-analytical Hamilton method are deduced . The solving procedure of the transient thermal elastic problem of laminates is given. By numerical examples , the thermal stress of composite laminates is studied during curing down process. The results show that great peaks of thermal stress will occur in the laminates during the curing down process. And , these peaks are the reasons which lead to damage of laminates during process. The work of this paper has reference value to the study of laminates during curing process. |
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