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| Stress analysis of a microelectronic component during manufacturing process |
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| DOI：10.7511/jslx19961002 |
| KeyWord:finite element method,stress analysis/microelectronic component,manufacturing process, |
| Xu Qianjun Yu Shouwen |
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| Abstract: |
| The residual stress distributions of a typical microelectronic component during manufacturing process and their evolution is discussed in this paper. Unlike the majority of the simular work,instead of analysing the stress state just induced by the temperature history of a estasblished structure, we attempt to simulate every aspect during the process, especially the stress rearrange ment induced by configuration changing. The method we used is to control some elements to come into action at the very chosed time. This approach is proved to be very effective to simulate variable manufacturing process. |
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