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| 高过载环境下弹载贴片电容失效机理探究及其焊点形态参数的优化设计 |
| Research on Failure Mechanism and Optimal Design of Solder Joint Shape Parameters of Projectile-borne Ceramic Capacitor under High Overload Impact |
| 投稿时间：2024-11-15 修订日期：2024-12-07 |
| DOI： |
| 中文关键词: 贴片电容 高过载环境 印制板电路板 失效机理 优化设计 |
| 英文关键词:Multilayer Ceramic Capacitor high overload environment printed circuit board failure mechanism optimal design |
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| 中文摘要: |
| 弹载贴片电容在炮射高过载环境中承受应力波、惯性力等复杂载荷的耦合作用，导致其极易发生失效，严重影响炮弹的功能可靠性。因此，本文通过高速冲击试验与数值模拟仿真相结合的方式，深入探究高过载环境下弹载贴片电容的失效机理并优化焊点结构以提升其抗高过载能力。首先根据薄板理论推导印制板在高过载环境下的临界曲率，量化贴片电容的损伤失效；然后基于最小能量原理建立贴片电容焊点的预测形态；紧接着，构建并验证含弹载器件的数值模型，进而分析弹载贴片电容的过载响应；最后通过构建含焊点形态参数的优化模型并基于支持向量回归模型和差分进化算法对其进行优化设计。研究结果表明，在高过载环境下，印制板弯曲变形和相邻元件的挤压使得贴片电容受到拉应力作用，这是导致其焊点连接处发生断裂失效的主要原因，通过对焊点形态参数的优化设计，有效降低了其断裂失效的风险，为弹载贴片电容的失效分析和抗高过载设计提供了理论依据和手段。 |
| 英文摘要: |
| The projectile-borne Multilayer Ceramic Capacitor(MLCC) is subjected to complex coupling effects such as stress wave and inertia force in the high overload environment of shooting, which leads to its easy failure and seriously affects the functional reliability of the projectile. Therefore, through the combination of high-speed impact test and numerical simulation, this paper deeply explores the failure mechanism of the projectile-borne MLCC under high overload environment and optimizes the solder joint structure to improve its anti-high overload capability. First, the critical curvature of the Printed Circuit Board(PCB) under high overload environment is derived according to the thin plate theory, and the damage failure of the MLCC is quantified. The predicted shape of the solder joint of the MLCC is established based on the principle of minimum energy. Then, the numerical model of the projectile-borne device is constructed and verified, and the overload response to the projectile-borne MLCC is analyzed; Finally, the optimization model containing the shape parameters of solder joints is constructed and optimized based on Support Vector Regression and Difference Evolution. The research results show that in the high overload environment, the bending deformation of PCB and the extrusion of adjacent components cause the MLCC to be subjected to tensile stress, which is the main reason for the fracture failure of its solder joint. The optimal design of solder joint shape parameters effectively reduces the risk of fracture failure, providing a theoretical basis and means for failure analysis and anti-overload design of projectile-borne MLCC. |
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