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| 基于近场动力学的材料热力耦合损伤行为分析 |
| THERMAL-MECHANICAL COUPLING DAMAGE BEHAVIOR OF MATERIAL BASED ON PERIDYNAMICS |
| 投稿时间：2022-12-04 修订日期：2023-02-10 |
| DOI： |
| 中文关键词: 键型近场动力学 热力耦合 泊松比 陶瓷 裂纹 |
| 英文关键词:bond-based peridynamics thermal-mechanical coupling Poisson's ratio ceramic crack |
| 基金项目:省部共建耐火材料与冶金国家重点实验室基金(武汉科技大学)(G201407) |
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| 中文摘要: |
| 为对热载荷作用下材料的损伤破坏行为进行研究，本文提出了单键双参数近场动力学热力耦合模型，给出了该模型下键的断裂准则。该模型考虑了键的切向变形与温度变化之间的关系，解决了键型近场动力学热力耦合模型只能对定值泊松比材料进行求解的问题，可研究温度场作用下泊松比对材料损伤行为的影响。本研究采用该模型对热冲击作用下陶瓷片的损伤行为进行了模拟分析，结果表明通过该模型得到的裂纹萌生及裂纹扩展形态与实验结果吻合较好，进一步就泊松比对材料损伤破坏行为的影响进行研究，结果表明，随着泊松比增大，裂纹萌生时间提前，裂纹间距增大，而主裂纹长度会增加，泊松比的变化对热荷载作用下材料的破坏损伤行为有明显的影响。 |
| 英文摘要: |
| In order to study the damage behavior of materials under thermal loading, a two-parameter bond-based peridynamics thermal-mechanical coupling model is proposed and the fracture criterion of the bond is given in this paper. This model includes the relationship of the bond’s tangential deformation to the temperature. Comparing with the bond-based peridynamics thermal-mechanical coupling model, the materials without fixed Poisson's ratio are considered in this model, so this model can be applied to study the effects of Poisson's ratio on damage behavior of materials under thermal loading. The damage behavior simulation of ceramic plate under thermal shock loading was carried out, which shows that the crack initiation and propagation patterns obtained by this model are in agreement with the experimental results. Further researches on the influence of Poisson's ratio on material damage behavior show that, increasing Poisson's ratio results in earlier initiation of cracks, growth of the crack spacing and increase of the leading cracks length, which indicates that the Poisson's ratio significantly influences the material damage behavior under thermal loading. |
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