| 褚卫华,陈循,陶俊勇,王考.热循环加载条件下空洞对EBGA焊点可靠性的影响[J].计算力学学报,2005,22(1):119~123 |
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| 热循环加载条件下空洞对EBGA焊点可靠性的影响 |
| Effect of voids on the reliability of EBGA solder joints under thermal cycle |
| 修订日期：2003-04-02 |
| DOI：10.7511/jslx20051025 |
| 中文关键词: 焊点 空洞 热疲劳寿命 非线性有限元分析 粘塑性 |
| 英文关键词:solder joint,void,thermal fatigue life,nonlinear finite element analysis,viscoplasticity |
| 基金项目: |
| 褚卫华 陈循 陶俊勇 王考 |
| 国防科技大学机电工程与自动化学院机电工程研究所,湖南长沙410073 |
| 摘要点击次数: 1616 |
| 全文下载次数: 8 |
| 中文摘要: |
| 空洞是球栅阵列(BGA：Ball Grid Array)器件在装配过程中形成的主要缺陷之一，本文以增强性BGA(EBGA：Enhanced BGA)为研究对象，采用统一型粘塑性Anand本构方程描述Sn63Pb37的粘塑性力学行为，应用非线性有限元的方法分析了不同位置和大小的空洞对焊点疲劳寿命的影响，为制定装配后的BGA焊点接收标准提供理论参考。 |
| 英文摘要: |
| Voids in BGA (Ball Grid Array) solder joints have been considered as a main defect in assembly. By taken the EBGA (Enhanced-BGA) solder joints as an example in this paper, the unified viscoplastic Anand constitutive equation has been employed to represent the viscoplastic deformation behavior and nonlinear finite element method has been applied to study the effect of size, location of voids on the fatigue life of solder joints, therefore the theoretical reference to establishing the inspection criteria of voids in BGA solder joints has been supplied. |
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