| 杨正林,陈浩然.用Hamilton半解析法分析固化降温过程中的层间热应力[J].计算力学学报,1998,15(3):338~342 |
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| 用Hamilton半解析法分析固化降温过程中的层间热应力 |
| Using the semi-anal ytical Hamil ton method to study the thermal interl aminate stress of composites during cooling down process |
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| DOI：10.7511/jslx19983052 |
| 中文关键词: 层合板，热应力，Hamilton半解析法，瞬态 |
| 英文关键词:laminates,thermal stress,semi-analytical Hamilton method,transient |
| 基金项目:国家自然科学基金,辽宁省博士启动基金 |
| 杨正林 陈浩然 |
| 大连理工大学土木建筑学院，大连理工大学工程力学系 |
| 摘要点击次数: 1109 |
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| 中文摘要: |
| 推导了增量形式Ｈａｍｉｌｔｏｎ半解析法公式；给出了层合板瞬态热弹性问题的求解过程；对复合材料层合板在固化降温过程中的热应力进行了分析。结果表明，在降温过程中层合板内将会出现较大的应力峰值，这些应力峰值将是导致层合板在固化工艺过程中出现破坏的原因。本文的工作将对固化工艺研究具有参考价值。 |
| 英文摘要: |
| In this paper the incremental equations of semi-analytical Hamilton method are deduced . The solving procedure of the transient thermal elastic problem of laminates is given. By numerical examples , the thermal stress of composite laminates is studied during curing down process. The results show that great peaks of thermal stress will occur in the laminates during the curing down process. And , these peaks are the reasons which lead to damage of laminates during process. The work of this paper has reference value to the study of laminates during curing process. |
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