| 郭兆璞,陈浩然,段滋华.复合材料层合板粘弹性固化残余应力分析[J].计算力学学报,1996,13(4): |
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| 复合材料层合板粘弹性固化残余应力分析 |
| Thermo viscoelastic analysis of curing residual stresses in composite laminates |
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| DOI：10.7511/jslx19964059 |
| 中文关键词: 粘弹性 复合材料层合板 固化残余应力 有限元 |
| 英文关键词:viscoelastic,composite laminat,curing residual stress, |
| 基金项目:国家自然科学基金 |
| 郭兆璞 陈浩然 段滋华 |
| 大连理工大学工程力学研究所，太原工业大学 |
| 摘要点击次数: 1393 |
| 全文下载次数: 8 |
| 中文摘要: |
| 基于Ｓｃｈａｐｅｒｙ积分型粘弹性本构关系，推导了考虑横向剪切效应的复合材料层合板线性热粘弹性有限元分析列式，对层合板的粘弹性响应和加工成型过程中的残余应力进行了分析，给出一些有意义的结果 |
| 英文摘要: |
| A finite element analysis treating linear thermo viscoelastic residual stress response during the post cure cool down of composite laminates is presented. In the present analysis, Schaperys hereditary integral viscoelastic constitutive law is applied. The numerical results on stress and deformation histories are obtained for the composite laminates subjected to thermal loads. The results indicate that the viscoelastic effects are important on residual stresses during curing of composite laminates. Therefore, the use of elastic solutions as conservative estimates of the residual stress state in composite laminates is often inappropriate. |
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