| 徐千军,余寿文.微电子元件制造过程中的应力分析[J].计算力学学报,1996,13(1): |
|
| |
| 微电子元件制造过程中的应力分析 |
| Stress analysis of a microelectronic component during manufacturing process |
| |
| DOI：10.7511/jslx19961002 |
| 中文关键词: 有限元方法,应力分析/微电子元件,成型过程 |
| 英文关键词:finite element method,stress analysis/microelectronic component,manufacturing process, |
| 基金项目:国家自然科学基金，国家教委博士点基金 |
| 徐千军 余寿文 |
| 清华大学工程力学系!北京，100084 |
| 摘要点击次数: 1686 |
| 全文下载次数: 0 |
| 中文摘要: |
| 本文分析了一个典型的微电子元件在创造过程中残余应力的分布和演化．与以往大多数类似的分析工作的不同之处在于，我们并不是对一个已成型的结构再回过头去仅仅分析其温度历史下相应的应力状态，而是追踪了该结构成型过程的各个方面，尤其是由于工艺过程中结构几何形状的变化而引起的应力重分布．采用的方法则是控制某些材料所对应的单元在某一特定的时刻以后才起作用，这种方法对于各种制造过程的分析非常有效． |
| 英文摘要: |
| The residual stress distributions of a typical microelectronic component during manufacturing process and their evolution is discussed in this paper. Unlike the majority of the simular work,instead of analysing the stress state just induced by the temperature history of a estasblished structure, we attempt to simulate every aspect during the process, especially the stress rearrange ment induced by configuration changing. The method we used is to control some elements to come into action at the very chosed time. This approach is proved to be very effective to simulate variable manufacturing process. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
|
|
|
|
